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A heterogeneous memory organization with minimum energy consumption in 3D chip-multiprocessors

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Academic year: 2021

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Fig. 1.  An overview of the proposed architecure.
Fig. 3.  Overview of our model.
Fig. 4.  Overview of endurance model.
Fig. 9.  Life time of our proposed 3D memory architecture for each PARSEC  application normalized with respect to the Baseline

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